Electricity: conductors and insulators – Conduits – cables or conductors – Insulated
Reexamination Certificate
2006-09-19
2009-06-16
Nguyen, Chau N (Department: 2831)
Electricity: conductors and insulators
Conduits, cables or conductors
Insulated
Reexamination Certificate
active
07547847
ABSTRACT:
An electrical insulation tape that has a first and second carrier layer, and a dielectric thermally conductive, electrically insulative filler layer (24) that has mica particles/flakelets (6), filler particles (26) and a binder resin (28), disposed between the first and second carrier layers. The dielectric filler layer has mica flakelets (30), filler particles (32) and a binder resin. The ratio of mica flakelets to filler particles is at least 1:1 by volume, and the percentage of binder resin in the dielectric filler layer is 35-50% by volume. The first and second carrier layers are impregnated with a second resin.
REFERENCES:
patent: 3246271 (1966-04-01), Ford
patent: 3866316 (1975-02-01), Takechi et al.
patent: 3974302 (1976-08-01), Croop et al.
patent: 4001616 (1977-01-01), Lonseth et al.
patent: 4160926 (1979-07-01), Cope et al.
patent: 4335367 (1982-06-01), Mitsui et al.
patent: 4361661 (1982-11-01), Jackson
patent: 4400226 (1983-08-01), Horrigan
patent: 4427740 (1984-01-01), Stackhouse et al.
patent: 4634911 (1987-01-01), Studniarz et al.
patent: 4694064 (1987-09-01), Tomalia et al.
patent: 4704322 (1987-11-01), Roberts
patent: 4760296 (1988-07-01), Johnston et al.
patent: 4806806 (1989-02-01), Hjortsberg et al.
patent: 5011872 (1991-04-01), Latham et al.
patent: 5037876 (1991-08-01), Birkle et al.
patent: 5126192 (1992-06-01), Chellis et al.
patent: 5281388 (1994-01-01), Palmer et al.
patent: 5466431 (1995-11-01), Dorfman et al.
patent: 5510174 (1996-04-01), Litman
patent: 5540969 (1996-07-01), Schuler
patent: 5578901 (1996-11-01), Blanchet-Fincher et al.
patent: 5723920 (1998-03-01), Markovitz et al.
patent: 5780119 (1998-07-01), Dearnaley et al.
patent: 5801334 (1998-09-01), Theodorides
patent: 5878620 (1999-03-01), Gilbert et al.
patent: 5904984 (1999-05-01), Smith et al.
patent: 5938934 (1999-08-01), Balogh et al.
patent: 5982056 (1999-11-01), Koyama et al.
patent: 6015597 (2000-01-01), David
patent: 6048919 (2000-04-01), McCullough
patent: 6103382 (2000-08-01), Smith et al.
patent: 6130495 (2000-10-01), Schulten et al.
patent: 6130496 (2000-10-01), Takigawa et al.
patent: 6140590 (2000-10-01), Baumann et al.
patent: 6160042 (2000-12-01), Ishida
patent: 6190775 (2001-02-01), Smith et al.
patent: 6238790 (2001-05-01), Smith et al.
patent: 6255738 (2001-07-01), Distefano et al.
patent: 6261424 (2001-07-01), Goncharenko et al.
patent: 6261481 (2001-07-01), Akatsuka et al.
patent: 6265068 (2001-07-01), David et al.
patent: 6288341 (2001-09-01), Tsunoda et al.
patent: 6344271 (2002-02-01), Yadav et al.
patent: 6359232 (2002-03-01), Markovitz et al.
patent: 6393642 (2002-05-01), Pollman et al.
patent: 6396864 (2002-05-01), O'Brien et al.
patent: 6432537 (2002-08-01), Devlin et al.
patent: 6504102 (2003-01-01), Tsunoda
patent: 6506331 (2003-01-01), Meguriya
patent: 6509063 (2003-01-01), McCarthy
patent: 6548172 (2003-04-01), David et al.
patent: 6572937 (2003-06-01), Hakovirta et al.
patent: 6632561 (2003-10-01), Bauer et al.
patent: 6635720 (2003-10-01), Tomalia et al.
patent: 6746758 (2004-06-01), Tsunoda et al.
patent: 6821672 (2004-11-01), Zguris
patent: 6882094 (2005-04-01), Dimitrijevic et al.
patent: 6905655 (2005-06-01), Gabriel et al.
patent: 6974627 (2005-12-01), Morita et al.
patent: 7033670 (2006-04-01), Smith
patent: 7042346 (2006-05-01), Paulsen
patent: 7120993 (2006-10-01), Yamamoto et al.
patent: 7180409 (2007-02-01), Brey
patent: 7189778 (2007-03-01), Tobita et al.
patent: 7425366 (2008-09-01), Okamoto et al.
patent: 2002/0058140 (2002-05-01), Dana et al.
patent: 2002/0070621 (2002-06-01), Mori et al.
patent: 2002/0098285 (2002-07-01), Hakovirta et al.
patent: 2003/0035960 (2003-02-01), Tsunoda et al.
patent: 2003/0040563 (2003-02-01), Sagal et al.
patent: 2004/0094325 (2004-05-01), Yoshida et al.
patent: 2004/0152829 (2004-08-01), Tobita et al.
patent: 2004/0241439 (2004-12-01), Morita et al.
patent: 2005/0097726 (2005-05-01), Yamamoto et al.
patent: 2005/0116336 (2005-06-01), Chopra et al.
patent: 2005/0161210 (2005-07-01), Zhong et al.
patent: 2005/0208301 (2005-09-01), Okamoto et al.
patent: 2005/0236606 (2005-10-01), Toas et al.
patent: 2005/0245644 (2005-11-01), Smith et al.
patent: 2005/0274450 (2005-12-01), Smith et al.
patent: 2005/0274540 (2005-12-01), Smith et al.
patent: 2005/0274774 (2005-12-01), Smith et al.
patent: 2005/0277349 (2005-12-01), Smith et al.
patent: 2005/0277350 (2005-12-01), Smith et al.
patent: 2005/0277351 (2005-12-01), Smith et al.
patent: 2005/0277721 (2005-12-01), Smith et al.
patent: 2006/0034787 (2006-02-01), Bujard
patent: 2006/0142471 (2006-06-01), Shindo
patent: 2006/0231201 (2006-10-01), Smith et al.
patent: 2006/0234027 (2006-10-01), Huusken
patent: 2006/0234576 (2006-10-01), Smith et al.
patent: 2006/0258791 (2006-11-01), Okamoto et al.
patent: 2006/0280873 (2006-12-01), Smith et al.
patent: 2006/0281380 (2006-12-01), Smith et al.
patent: 2006/0281833 (2006-12-01), Smith et al.
patent: 2007/0026221 (2007-02-01), Stevens et al.
patent: 2007/0114704 (2007-05-01), Stevens et al.
patent: 2007/0141324 (2007-06-01), Stevens et al.
patent: 2008/0050580 (2008-02-01), Stevens et al.
patent: 2008/0066942 (2008-03-01), Miller
patent: 2008/0262128 (2008-10-01), Stevens et al.
patent: 0 157 936 (1985-10-01), None
patent: 0266602 (1988-11-01), None
patent: 0 394 767 (1990-10-01), None
patent: 0 604 804 (1994-07-01), None
patent: 1 220 240 (2002-07-01), None
patent: 1 300 439 (2003-04-01), None
patent: 1 383 226 (2004-01-01), None
patent: 1 384 567 (2004-01-01), None
patent: 1 486 997 (2004-12-01), None
patent: 1 530 223 (2005-05-01), None
patent: 881036 (1961-11-01), None
patent: 56029305 (1981-03-01), None
patent: 03205443 (1991-09-01), None
patent: 06313267 (1994-11-01), None
patent: 10-088201 (1998-04-01), None
patent: 10-211659 (1998-08-01), None
patent: 2002212422 (2002-07-01), None
patent: 200506389 (2005-01-01), None
patent: 2005-199562 (2005-07-01), None
patent: WO 95/02504 (1995-01-01), None
patent: WO 96/28073 (1996-09-01), None
patent: WO 98/41993 (1998-09-01), None
patent: WO 99/26286 (1999-05-01), None
patent: WO 00/56127 (2000-09-01), None
patent: WO 01/68749 (2001-09-01), None
patent: WO 01/84659 (2001-11-01), None
patent: WO 03/040445 (2003-05-01), None
patent: WO 2004/006271 (2004-01-01), None
patent: WO 2004/052999 (2004-06-01), None
patent: WO 2004/067606 (2004-08-01), None
patent: WO 2005/069312 (2005-07-01), None
patent: WO 2005/106089 (2005-11-01), None
patent: WO 2005/123825 (2005-12-01), None
patent: WO 2005/124790 (2005-12-01), None
patent: WO 2006/002014 (2006-01-01), None
patent: WO 2006/007385 (2006-01-01), None
Tari et al., “Impacts on Turbine Generator Design by the Application of Increased Thermal Conducting Stator Insulation” Cigre SC11-01 Meeting, Paper No. 132 (2002).
Sun et al., “Fundamental Research on Surface Modification of Nano-sized Silica for Underfill Applications” 2004 Electronic Components and Technology Conference (2004).
Brutsch et al., “New High Voltage Insulation with Increased Thermal Conductivity” Electrical Electronics Insulation Conference 1993 Proceedings, (Oct. 1993).
Tari et al., “A High Voltage System with Increased Thermal Conductivity for Turbo Generators” Coil Winding, Insulation and Electrical Manufacturing Conference (2001).
Von Roll Isola, “Mica Tapes,” product literature, 381.58, date unknown.
Tomoyuki Matsumura “Phase Structures and Thermal and Conductive Properties of Epoxy-Alumina Hybrids Filled with Conductive Fillers,” STN Database No. 2002:257918, Apr. 8, 2002, Abstract pp. 1-2; XP-002356007.
Yasufumi Shibata, “Lipophillic Inorganic-Organic Fillers with Low Frictional Coefficient,” STN Database No. 2002:568167, Jul. 31, 2002, Abstract pp. 1-3; XP-002355912.
Derwent Acc-No. 1980-39239C (JP 55053802 A Derwent Abstract) (Nippon Mica Seisaku).
Product Data Sheet for Polar Therm Boron Nitride Powder Grades PT120, PT140, PT160, and PT 180, provided by Momentive Performance Materials (2007).
Nguyen Chau N
Siemens Energy Inc.
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