High-thermal conductivity circuit board

Details High-thermal conductivity circuit board High-thermal conductivity circuit board

1996-02-20

1997-11-11

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 174257, 361720, 428901, H05K 720

Patent

active

056870620

ABSTRACT:
A thermally efficient circuit board has a base layer with high thermal conductivity and a thermal expansion coefficient close to that of silicon, such as aluminum silicon carbide. Above the base layer is a layer of anodized metal, either a separate material, such as aluminum, which is formed on the base and then anodized, or an anodized portion of the base itself. To the anodized metal is then applied a sealant material of lower thermal conductivity, but good electrically insulative and adhesive qualities, such as Teflon FEP. The sealant flows into cavities in the porous anodized metal structure, creating a well-anchored bond. A metal foil layer is then bonded to the surface of the sealant, and used to pattern conductive circuit paths using conventional methods.

REFERENCES:
patent: 3165672 (1965-01-01), Gellert
patent: 4056681 (1977-11-01), Cook, Jr.
patent: 4633035 (1986-12-01), McMonagle
patent: 4675784 (1987-06-01), Dahlberg et al.

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