High thermal conductivity ceramic body

Details High thermal conductivity ceramic body High thermal conductivity ceramic body

1985-12-18

1990-01-30

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Refractory

501 98, 501152, 264 61, 264 65, C04B 3558

Patent

active

048973726

ABSTRACT:
A process for producing an aluminum nitride ceramic body having a composition defined and encompassed by polygon A4F5F6F4 but excluding line F6F4 of FIG. 4, a porosity of less than about 10% by volume, and a thermal conductivity greater than 0.90 W/cm.K at 25.degree. C. which comprises forming a mixture comprised of aluminum nitride powder containing oxygen, yttrium oxide, and free carbon, shaping said mixture into a compact, said mixture and said compact having a composition wherein the equivalent % of yttrium and aluminum ranges from point F5 up to point F4 of FIG. 4, said compact having an equivalent % composition of Y, Al, O and N outside the composition defined and encompassed by polygon A4F5F6F4 of FIG. 4, heating said compact to a temperature at which its pores remain open reacting said free carbon with oxygen contained in said aluminum nitride producing an deoxidized compact, said deoxidized compact having a composition wherein the equivalent % of Al, Y, O and N is defined and encompassed by polygon A4F5F6F4 but excluding line F6F4 of FIG. 4, and sintering said deoxidized compact at a temperature of at least about 1830.degree. C. producing said ceramic body.

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