High thermal conductivity ceramic body

Details High thermal conductivity ceramic body High thermal conductivity ceramic body

1986-05-30

1989-04-04

Dixon, Jr., William R.

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 61, 264 63, 264 66, 501 96, 501 98, C04B 3558, F27D 706

Patent

active

048184551

ABSTRACT:
A process for producing an aluminum nitride ceramic body having a composition defined and encompassed by polygon ABCFGH of FIG. 2, a porosity of less than about 10% by volume, and a thermal conductivity greater than 0.70 W/cm.K at 25.degree. C. which comprises forming a mixture comprised of aluminum nitride powder containing oxygen, gadolinium oxide, and free carbon, shaping said mixture into a compact, said mixture and compact having a composition wherein the equivalent % of gadolinium and aluminum ranges from point A to point F of FIG. 2, said mixture and said compact having an equivalent % composition of Gd, Al, O and N outside the composition defined and encompassed by polygon ABCFGH of FIG. 2, heating said compact to a temperature at which its pores remain open reacting said free carbon with oxygen contained in said aluminum nitride producing a deoxidized compact, said deoxidized compact having a composition wherein the equivalent % of Al, Gd, O and N is defined and encompassed by polygon ABCFGH of FIG. 2, and sintering said deoxidized compact producing said ceramic body.

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