High thermal conductivity aluminum nitride ceramic body

Compositions: ceramic – Ceramic compositions – Refractory

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

264 65, 423412, 501 98, C04B 3558

Patent

active

045336458

ABSTRACT:
The process comprises forming a mixture comprised of aluminum nitride powder and free carbon wherein the aluminum nitride has a predetermined oxygen content higher than about 0.8% by weight and wherein the amount of free carbon reacts with such oxygen content to produce a deoxidized powder or compact having an oxygen content ranging from greater than about 0.35% by weight to about 1.1% by weight and which is at least 20% by weight lower than the predetermined oxygen content, heating the mixture or a compact thereof to react the carbon and oxygen producing the deoxidized aluminum nitride, and sintering a compact of the deoxidized aluminum nitride producing a ceramic body having a density greater than 85% of theoretical and a thermal conductivity greater than 0.5 W/cm.multidot.K. at 22.degree. C.

REFERENCES:
patent: 3108887 (1963-10-01), Lenie et al.
patent: 3261667 (1966-07-01), O'Connor
patent: 4152182 (1979-05-01), Rutz
patent: 4203733 (1980-05-01), Tanaka et al.
patent: 4435513 (1984-03-01), Komeya et al.
patent: 4478785 (1984-10-01), Huseby et al.
Chem. Abstracts, 99: 26974q and 26975r, Jul. 25, 1983.
Circular, Gem-680, Aluminum Nitride, 2 pages, Jun. 1981.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High thermal conductivity aluminum nitride ceramic body does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High thermal conductivity aluminum nitride ceramic body, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High thermal conductivity aluminum nitride ceramic body will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-512716

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.