High thermal conductive silicon nitride sintered body, method of

Compositions: ceramic – Ceramic compositions – Refractory

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C04B 35584

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active

057444102

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BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a high thermal conductive silicon nitride sintered body, a method of producing the same, and a press-contacted body and, more particularly, to a high thermal conductive silicon nitride sintered body which achieves high strength characteristics, high thermal conductivity, and good heat-radiating characteristics, and is preferably used as various semiconductor substrate or press-contacted body, a method of producing the high thermal conductive silicon nitride sintered body, and a press-contacted body.


BACKGROUND ART

A press-contacting heat-radiating plate, joined to a heat-generating part by press contact, for press contact to radiate heat from the heat-generating part out of the system is popularly used in various electronic equipment or electronic devices. A press-contacted body such as a thyristor is popularly used as a semiconductor element having a current control function such as a function of switching a large current or a function of converting AC to DC is also popularly used.
FIG. 2 is a sectional view showing a structure of a thyristor serving as a silicon control rectifier (SCR). This thyristor is constituted by a silicon junction body 3 inserted between a copper stud 1 serving as an anode and a cathode wire 2, a gate wire 4 connected to the silicon junction body 3, a ceramic seal 5 and a case 6 which seal the silicon junction body 3 to shield the silicon junction body 3 from external air, and a planar heat-radiating plate 7 which is in press contact with the copper stud 1 to radiate heat generated in the structure out of the structure. A state across the anode and the cathode is changed from an OFF (cut) state into an ON (start) state by a gate current flowing in the gate wire 4 to control a large current.
In recent years, an amount of heat generated from parts tends to sharply increase in accordance with an increase in integration density and output power of the heat-generating parts, a heat-radiating plate which has good heat-radiating characteristics is strongly demanded. For example, to cope with an increase in electric power demand, a thyristor having a more large capacity is demanded. A heat-radiating plate which can inevitably prevent dielectric breakdown from occurring by heat generation and has excellent heat-radiating characteristics and insulating characteristics is demanded.
As a material constituting the heat-radiating plate 7 for such a thyristor, alumina (Al.sub.2 O.sub.3) is generally used. However, alumina has poor heat-radiating characteristics because alumina has a low thermal conductivity of about 20 W/m. K, and a heat-radiating plate coping with an increase in output power cannot be easily formed. An aluminum nitride (AlN) sintered body which has a thermal conductivity twice to three times that of alumina and excellent thermal conductivity has been also used as a material constituting a heat-radiating plate.
On the other hand, ceramic sintered bodies containing silicon nitride as a main component have strong heat resistance. They resist temperatures as high as 1,000.degree. C. or higher. Silicon nitride ceramic sintered bodies also have strong thermal shock resistance due to their low thermal expansivity. Because of these characteristics, silicon nitride ceramic sintered bodies are expected to be widely used as high-temperature structural materials, most of which are currently made of heat-resistant super alloys. In fact, silicon nitride ceramic sintered bodies are already used for high-strength heat-resistant components and parts of, for example, gas turbines, engines or steel making machines. Further, because of their high corrosion resistance to metal, some silicon nitride ceramic sintered bodies are applied to melt-resistant material for molten metal. Still further, because of their high abrasion resistance, some silicon nitride ceramic sintered bodies are applied to or tested for cutting tools or sliding parts such as bearings.
Various sintering compositions for silicon nitride ceramic sintered bodies are known: silico

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patent: 5399536 (1995-03-01), Yamakawa et al.
patent: 5439856 (1995-08-01), Komatsu
patent: 5449649 (1995-09-01), Li et al.
patent: 5618768 (1997-04-01), Higuchi et al.

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