Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Reexamination Certificate
2006-12-01
2009-06-02
Tran, Binh X (Department: 1792)
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
C216S018000, C216S019000, C216S076000, C216S078000
Reexamination Certificate
active
07540969
ABSTRACT:
A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as an option, two conducting layers are formed respectively on two sides of the metal core substrate and are on top of the insulting layers. The conducting layers are patterned according to designs appropriate for the products. Because the high thermal conducting circuit substrate fabricated as the aforementioned manufacturing process mainly comprises the metal core substrate, it helps to elevate the thermal conduction of the circuit substrate itself.
REFERENCES:
patent: 5776817 (1998-07-01), Liang
patent: 6033588 (2000-03-01), Yu
patent: 2003/0040138 (2003-02-01), Kobayashi et al.
patent: 2003/0203623 (2003-10-01), Coomer
patent: 2006/0231853 (2006-10-01), Tanaka et al.
Ho Chung W.
Shen Leo
J.C. Patents
Subtron Technology Co. Ltd.
Tran Binh X
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