High tensile strength electrodeposited copper foil and process o

Details High tensile strength electrodeposited copper foil and process o High tensile strength electrodeposited copper foil and process o

1997-05-13

1999-09-28

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic synthesis

Preparing single metal

205241, 205296, 205 77, C25C 112, C25D 358, C25D 338, C25D 104

Patent

active

059582090

ABSTRACT:
A high tensile strength copper foil having a matte side roughness Rz of 2.5 .mu.m or less and a tensile strength of 40,000 Kgf/mm.sup.2 after heating one hour at 180.degree. C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominantly (111) orientation.

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