Alloys or metallic compositions – Copper base – Tin containing
Patent
1991-05-22
1992-06-23
Roy, Upendra
Alloys or metallic compositions
Copper base
Tin containing
148433, 420476, C22C 900
Patent
active
051241242
ABSTRACT:
A high-tensile copper alloy for current conduction and having superior flexibility is disclosed. The high-tensile copper alloy, in a first embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.05 to 0.3% by weight of Sn; and the balance of Cu. The high-tensile copper alloy, in a second embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.2% by weight of Co; and the balance of Cu. The high-tensile copper alloy, in a third embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.3% by weight of Mg; and the balance of Cu. The high-tensile copper alloy, in a fourth embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.25% by weight of In; from 0.05 to 0.25% by weight of Sn; from 0.05 to 0.20% by weight of Mg; and the balance of Cu. The high-tensile copper alloy, in the fifth embodiment is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.25% by weight of In; from 0.05 to 0.20% by weight of Co; from 0.05 to 0.20% by weight of Mg; and the balance of Cu.
REFERENCES:
patent: 3977869 (1976-08-01), Steine et al.
Fujino Toshihiro
Nishijima Tamotsu
Ohashi Yasusuke
Taki Yasuhito
Roy Upendra
Yazaki -Corporation
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