High temperature transfer molding resins

Stock material or miscellaneous articles – Composite

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428524, 4284735, 528125, 528128, 528229, 528170, 528353, 548473, 548476, C07D20948, C08G 802, C08G 7310

Patent

active

061240354

ABSTRACT:
High temperature resins containing phenylethynyl groups that are processable by transfer molding have been prepared. These phenylethynyl containing oligomers were prepared from aromatic diamines containing phenylethynyl groups and various ratios of phthalic anhydride and 4-phenylethynlphthalic anhydride in glacial acetic acid to form a mixture of imide compounds in one step. This synthetic approach is advantageous since the products are a mixture of compounds and consequently exhibit a relatively low melting temperature. In addition, these materials exhibit low melt viscosities which are stable for several hours at 210-275.degree. C., and since the thermal reaction of the phenylethynyl group does not occur to any appreciable extent at temperatures below 300.degree. C., these materials have a broad processing window. Upon thermal cure at .about.300-350.degree. C., the phenylethynyl groups react to provide a crosslinked resin system. These new materials exhibit excellent properties and are potentially useful as adhesives, coatings, films, moldings and composite matrices.

REFERENCES:
patent: 5412066 (1995-05-01), Hergenrother et al.
patent: 5606014 (1997-02-01), Connell et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High temperature transfer molding resins does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High temperature transfer molding resins, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High temperature transfer molding resins will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2098104

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.