High temperature thermosetting resin compositions

Details High temperature thermosetting resin compositions High temperature thermosetting resin compositions

1987-04-27

1988-10-11

Seccuro, Carman J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525208, 525210, C08L 2508, C08L 2514, C08L 3500, C08L 4500

Patent

active

047772271

ABSTRACT:
High temperature thermosetting resin compositions which may be used as a polymer matrix for a printed circuit board will comprise a terpolymer of an ethylenically monosubstituted unsaturated monomer in which said substituent is an aromatic moiety such as styrene, an ethylenically alpha,beta-disubstituted unsaturated monomer in which each substituent is an aromatic or benzylic moiety such as acenaphthylene and a glycidyl ester of a monoethylenically unsaturated acid such as glycidyl methacrylate cross-linked with a copolymer of an anhydride of a dibasic olefinic acid such as maleic anhydride and an ethylenically monosubstituted unsaturated monomer in which said substituent is an aromatic moiety such as styrene.

REFERENCES:
patent: 2510647 (1950-06-01), Miller et al.
patent: 3852236 (1974-12-01), Heilman
patent: 3888943 (1975-06-01), Labana et al.

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