High temperature superconductor deposition by sputtering

Superconductor technology: apparatus – material – process – High temperature – per se – Having tc greater than or equal to 150 k

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20419215, 20419224, 427 34, 427423, 505731, C23C 1434, H01L 3924

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active

051964007

ABSTRACT:
A target which is a good conductor of heat and electricity is plasma sprayed with a weakly conducting material such as a metallic oxide. The target is then employed in a magnetron sputtering apparatus to sputter the material sprayed onto the target onto a substrate. The technique permits use of power densities and target sizes and shapes which are advantageous for sputtering substrates having large surface areas.

REFERENCES:
patent: 3669871 (1972-06-01), Elmgren et al.
patent: 4491509 (1985-01-01), Krause
patent: 4834856 (1989-05-01), Wehner
patent: 4842704 (1989-06-01), Collins et al.
patent: 4902671 (1990-02-01), Koinuma et al.
patent: 4929595 (1990-05-01), Wu
patent: 4968665 (1990-11-01), Ohuchi et al.
patent: 5002648 (1991-03-01), Morach et al.
"Hoehler and Neeb, Preparation of Thin TBa.sub.2 Cu.sub.3 O.sub.7 Layers . . . by d.c. Magnetron Sputtering", Journal of the Less Common Metals 151 (1989) pp. 341-344.
Perkin-Elmer Metco Division, Advertising Brochure, Plasma Spray Technology for Superconductor Research, 1988, p. 2, col. 3.

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