Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Patent
1981-10-29
1985-05-21
Michl, Paul R.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
525431, 524602, C08K 308
Patent
active
045187355
ABSTRACT:
An adhesive composition for attaching semiconductor die to a substrate of a semiconductor device package includes a crosslinkable resinous polyimide, and an aminosilane crosslinking agent. For applications where backside contact to the semiconductor die is desired, the composition also contains finely divided conductive metal, such as silver flakes. When used in a novel process in which the adhesive composition is placed on the semiconductor device substrate prior to gelling, outgassed, a semiconductor die is placed on the outgassed composition, and the composition cured, the resulting semiconductor device package meets military specifications with a substantial cost reduction.
REFERENCES:
patent: 3288754 (1969-11-01), Green
Belani Jadish G.
Goodrich Gary B.
Higgins Willis E.
Michl Paul R.
National Semiconductor Corporation
Winters Paul
Woodward Gail W.
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