High-temperature spin-on temporary bonding compositions

Details High-temperature spin-on temporary bonding compositions High-temperature spin-on temporary bonding compositions

2011-05-03

2011-05-03

Gulakowski, Randy (Department: 1766)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

C528S026000, C528S038000, C528S353000

Reexamination Certificate

active

07935780

ABSTRACT:
New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

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