High temperature resistant binders

Details High temperature resistant binders High temperature resistant binders

1981-09-14

1984-10-30

Lieberman, Allan M.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524186, 524595, 524596, 524597, 524598, 525495, 525504, 525506, C08K 328, C08K 338, C08L 610

Patent

active

044800681

ABSTRACT:
A phenol-formaldehyde resol to which urea has been added is mixed with a boric acid-hydroxyl-amide component to provide high temperature resistant binder compositions for use in the manufacture of thermally stable bonded mineral fibre insulation structures.

REFERENCES:
patent: 1969761 (1934-08-01), Rosenblum
patent: 2197855 (1940-04-01), Ellis
patent: 2667466 (1954-01-01), Nagy
patent: 2748101 (1956-05-01), Shappell
patent: 2931738 (1960-04-01), Stalego
patent: 2941904 (1960-06-01), Stalego
patent: 2990307 (1961-06-01), Stalego
patent: 3001929 (1961-09-01), Moy et al.
patent: 3002857 (1961-10-01), Stalego
patent: 3004941 (1961-10-01), Mestdagh et al.
patent: 3218279 (1965-11-01), Stalego
patent: 3223668 (1965-12-01), Stalego
patent: 3624246 (1971-11-01), Deuzeman
patent: 3740358 (1973-06-01), Christie et al.
patent: 3846275 (1974-11-01), Urban
patent: 3956204 (1976-05-01), Higginbottom
patent: 4045398 (1977-08-01), Dahms
patent: 4112188 (1978-09-01), Dahms
patent: 4130538 (1978-12-01), Shutt
patent: 4176105 (1979-11-01), Miedsner
patent: 4182697 (1980-01-01), Schmidt
patent: 4235950 (1980-11-01), Miedaner
patent: 4251590 (1981-02-01), Rubright et al.
patent: 4272403 (1981-06-01), Meyer et al.

Affiliated with

Also associated with

Rating

High temperature resistant binders does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High temperature resistant binders, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High temperature resistant binders will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1102736