High temperature removal of H.sub.2 S from reducing gas

Details High temperature removal of H.sub.2 S from reducing gas High temperature removal of H.sub.2 S from reducing gas

1978-01-05

1980-06-10

Thomas, Earl C.

Chemistry of inorganic compounds

Modifying or removing component of normally gaseous mixture

Direct contact with molten material

423232, 423234, 423563, 423574R, B01D 5334

Patent

active

042072980

ABSTRACT:
High temperature reducing gas is scrubbed of H.sub.2 S and other gaseous sulfur compounds at high temperature (>800.degree. K.) in a highly efficient regenerative process. The scrubbing is effected in at least two sequential stages. The first stage scrubbing medium is a molten salt comprised essentially of molten alkali carbonates, sulfides, and hydroxides. The second stage is optionally either a metallic melt comprised of copper or a second molten salt. The copper melt is regenerated with air. The salt melts are regenerated with steam and/or CO.sub.2. When two or more salt stages are used, they are regenerated stagewise countercurrently to the scrubbing sequence.

REFERENCES:
patent: 3919390 (1975-11-01), Moore
patent: 3954938 (1976-05-01), Meissner
patent: 3966875 (1976-06-01), Braetzler
patent: 3996335 (1976-12-01), Wolk et al.

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