High temperature release sheet for printed circuit boards

Details High temperature release sheet for printed circuit boards High temperature release sheet for printed circuit boards

1988-11-02

1990-10-30

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

524120, 524222, 524291, 524303, 524342, 524343, 524347, 524398, 524406, 524449, 524451, 524606, C08G 6926

Patent

active

049669605

ABSTRACT:
A process and nylon release sheet for manufacturing printed circuit boards from epoxy prepregs is disclosed. In such process layers of the prepregs are separated from one another by a release sheet. The release sheet comprises an aliphatic or aromatic nylon or nylon copolymer which is a condensation product of a dicarboxylic acid and a diamine. The nylon film contains a heat stabilizer and an inorganic particulate antiblock additive, e.g. diatomaceous earth, glass beads, amorphous silica, talc, mica and molybdenum disulphide. The nylon may be toughened by the addition of a phosphorus-containing catalyst or an epoxide.

REFERENCES:
patent: 2705227 (1955-03-01), Stamatoff
patent: 4339556 (1982-07-01), Baer
patent: 4730016 (1988-03-01), Fujii et al.
patent: 4786678 (1988-11-01), Dobreski et al.
patent: 4810745 (1989-03-01), Pike et al.

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