High temperature release films

Details High temperature release films High temperature release films

1997-02-06

1999-01-12

Kiliman, Leszek

Stock material or miscellaneous articles

Composite

Of polyamide

4284758, 4284761, 4284763, 4284769, 428412, 428516, 428483, 15624411, 156325, 156326, 156327, B32B 2708, B29C 4700

Patent

active

058585508

ABSTRACT:
Multilayered films produced by coextruding or laminating films comprised of at least one layer of polymethylpentene, at least one layer of a polyamide and an intermediate polymeric adhesive layer. The polyamide layer allows the polymethylpentene layer to be stretched up to 6 times its original length. Such a high orientation ratio for the mulitlayered film increases the mechanical strength and toughness properties of the film. The mulitlayered films are suitable for use as release films for high temperature composite applications such as printed circuit boards.

REFERENCES:
patent: 4668571 (1987-05-01), Moriarty, Jr.
patent: 5002833 (1991-03-01), Kinsey et al.
patent: 5055355 (1991-10-01), DeAntonis
patent: 5057372 (1991-10-01), Imfeld et al.
patent: 5079052 (1992-01-01), Heyes
patent: 5080979 (1992-01-01), Shigemoto
patent: 5106692 (1992-04-01), Shigemoto
patent: 5227255 (1993-07-01), Akao

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