High temperature rectifying contact

Active solid-state devices (e.g. – transistors – solid-state diode – Schottky barrier – To compound semiconductor

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257472, 257 77, 257627, 437176, H01L 2948

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active

052124010

ABSTRACT:
A rectifying contact for use at high temperatures including a monocrystalline semiconducting diamond layer on a substrate and a heteroepitaxial metal layer thereon. The metal layer has a lattice match with the diamond and is deposited on the diamond substantially in atomic registry therewith. The metal and diamond form a rectifying contact which has good mechanical adhesion and provides stable rectifying operation at elevated temperatures. The metal layer may be formed by deposition in an ultra-high vacuum. In alternate embodiments, the metal layer may be formed on a monocrystalline semiconducting diamond substrate or on at least one monocrystalline diamond area of a textured polycrystalline layer.

REFERENCES:
patent: 4062660 (1977-12-01), Nicholas et al.
patent: 4982243 (1991-01-01), Nakahata et al.
patent: 5008732 (1991-04-01), Kondo et al.
patent: 5055424 (1991-10-01), Zeidler et al.
Lurie & Wilson, "The Diamond Surface", Surface Science, 65(1977), pp. 453-511.
Pickett & Erwin, "Electronic structure of an ideal diamond nickel (001) interface", Physical Review B, vol. 41, pp. 9756-9764 (1990).
Pavlidis, "The Growth of Epitaxial Thin Nickel Films on Diamond", Thin Solid Films, 42(1977), pp. 221-226.

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