High temperature probe card for testing integrated circuits

Details High temperature probe card for testing integrated circuits High temperature probe card for testing integrated circuits

1998-04-08

2000-05-16

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324762, G01R 3102

Patent

active

060642157

ABSTRACT:
A probe card for testing integrated circuits which maintains rigidity and probe alignment at elevated temperatures. The probe card has a number of probes radially oriented on an insulating plate with a nonuniform radial distribution. The probes extend through an insulating ring. The nonuniform radial distribution of probes has gaps which allows for bolt or attachment to attach a rigid plate to the insulating ring. The insulating plate can be made of printed circuit board material, the insulating ring can be made of epoxy. The rigid plate can be made of stainless steel or any other material that maintains rigidity at elevated temperatures. Preferably, the insulating plate also has a stiffener ring located opposite the insulating ring on the top side. The bolts extend through the stiffener ring. The insulating plate has vias which allow the probes to be electrically connected to test electronics located above a top side of the insulating plate. The rigid plate maintains the rigidity of the apparatus and provides heat shielding for the insulating ring and insulating plate. Alternatively, the rigid plate is located above the insulating plate and bolted to the stiffener ring.

REFERENCES:
patent: 5123639 (1992-06-01), Carlin et al.
patent: 5355079 (1994-10-01), Evans et al.
patent: 5521523 (1996-05-01), Kimura et al.
patent: 5670889 (1997-09-01), Okubo et al.
patent: 5884395 (1999-03-01), Dabrowiecki et al.

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