High temperature polyether imide compositions and method for mak

Details High temperature polyether imide compositions and method for mak High temperature polyether imide compositions and method for mak

1993-04-19

1996-07-09

McCamish, Marion E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525436, C08L 7700

Patent

active

055346022

ABSTRACT:
Polyetherimide compositions are provided having condensed bis (4-aminophenyl) sulfone units, diaminophenylindane units or a mixture thereof. These polyetherimides compositions have been found useful for making high temperature chip adhesives, laminating adhesives and film adhesives for high density interconnects in electronic circuitry.

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C. W. Eichelberger et al., High-density Interconnects for Electronic Packaging, SPIE, vol. 877, Micro-Optoelectronic Materials, pp. 90-91, (1988).
Probimide TM 200 Series, Soluble Polyimides for Microelectronics, Ciba-Geigy Corp., Plastics and Additives Division, Hawthorne, NY.

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