High temperature minimal (zero) insertion force socket

Details High temperature minimal (zero) insertion force socket High temperature minimal (zero) insertion force socket

1999-04-01

2001-01-30

Nguyen, Khiem (Department: 2839)

Electrical connectors

With coupling movement-actuating means or retaining means in...

Including compound movement of coupling part

C439S259000

Reexamination Certificate

active

06179640

ABSTRACT:

BACKGROUND OF THE INVENTION
This invention relates generally to the testing of electrical integrated circuits, and more particularly the invention relates to sockets for receiving packaged integrated circuits for test purposes.
The packaged integrated circuit typically includes a polymer or ceramic housing for a semiconductor chip with electrical leads extending from the package which are electrically connected to the semiconductor chip. In a dual in-line package (DIP), the electrical leads are arranged in two parallel rows with the leads depending from the bottom of the housing.
Packaged integrated circuits must undergo a number of different tests, each test requiring the insertion of the integrated circuit package and leads into a test socket. To prevent bending or damage to the leads, zero insertion force (ZIF) sockets have been devised to limit the force exerted on the leads when the package is inserted into a test socket. The most widely known and used ZIF sockets are from 3M Corporation and Aries Corporation. In these sockets the leads of a DIP (dual in-line package) are pinched between two pieces of metal which are, in turn, soldered to a printed circuit board. The metal pieces are held in place by the body of the ZIF socket which is typically made of plastic. The metal pieces are electrically conducting to provide a good electrical path from the DIP lead to the printed circuit board in which the ZIF socket is attached. In all cases, the bodies of these sockets are made of some organic material (plastics or polymers) which can only withstand temperatures as high as 250° C. for extended periods of time. The metal used to pinch the leads of the IC DIP packages are beryllium copper alloy or beryllium nickel alloy for a high temperature operation not to exceed 250° C. While these sockets perform well within their stated specifications, they cannot be used at temperatures in excess of 250° C. because the materials will decompose and fail.
The present invention is directed to providing a test socket which is simple in design and reliable in high temperature (above 250° C.) environments.
SUMMARY OF THE INVENTION
In accordance with the invention, a test socket includes at least two members having planar surfaces arranged to permit relative lateral movement between the two members. One member is a package support and has a plurality of holes extending therethrough for receiving the integrated circuit package leads. Each hole has sufficient size to receive a lead with minimal or no force. The second member is a contact support and has a plurality of contacts arranged to be in spaced juxtaposition with package leads when a package is inserted into or removed from the support member. The contacts are slidable into engagement with the package leads after the package is inserted.
In a preferred embodiment, the plurality of contacts comprise wires positioned in grooves in the second member with the grooves arranged in alignment with the holes in the first member. The two members are joined by linear translation device such as a cam mechanism whereby the two planar surfaces can be translated laterally for engaging and disengaging the package leads with the wire contacts.
For high temperature applications the two members can comprise anodized aluminum or a ceramic material such as silicon carbide, and the wire contacts can comprise Monel or other conductor which can withstand high temperature. The two planar surfaces can engage each other, or spacers can be provided between the surfaces to facilitate sliding.
The invention and objects and features thereof will be more readily apparent from the following detailed description and appended claims when taken with the drawings.


REFERENCES:
patent: 5021000 (1991-06-01), Scheibner
patent: 6004141 (1999-12-01), Abe et al.
patent: 6004152 (1999-12-01), Walkup et al.

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