High temperature metallization system for contacting semiconduct

Details High temperature metallization system for contacting semiconduct High temperature metallization system for contacting semiconduct

1990-07-23

1991-12-24

Jackson, Jr., Jerome

357 56, 357 30, 357 67, 357 69, H01L 3106, H01L 2940

Patent

active

050757636

ABSTRACT:
A metallization system for contacting semiconductor materials employed in high temperature applications that is thermally stable. The system can be utilized in the fabrication of electronic devices such as diodes, lasers, transistors, solar cells, and integrated circuits comprised of such devices.

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