High temperature lift-off technique

Details High temperature lift-off technique High temperature lift-off technique

1978-09-05

1980-09-23

Kendall, Ralph S.

Coating processes

Nonuniform coating

Applying superposed diverse coatings or coating a coated base

427 98, 427 99, 427 88, 430314, 430319, 29579, G03C 500

Patent

active

042243610

ABSTRACT:
A layer of resist is applied to a metal substrate, and a matrix is formed in the resist. A metal or dielectric mask having overhanging upper edges is formed by electroplating metal into the resist matrix which has preformed openings for defining the mask. The resist matrix is then removed from the substrate. A film is then deposited upon the substrate, where it is exposed, and the mask with the overhanging upper edges protecting the side walls of the mask from being covered. Then a chemical, such as an etchant, is applied to the side walls of the mask to remove it, lifting off the material deposited upon it. The mask is made by plating metal through apertures or coating of tapered holes.

REFERENCES:
patent: 2559389 (1951-07-01), Beeber et al.
patent: 3157505 (1974-11-01), Notley
patent: 3462349 (1969-08-01), Gorgenyi
patent: 3617373 (1971-11-01), Mott
patent: 3700510 (1972-10-01), Keene et al.
patent: 3799777 (1974-03-01), O'Keefe
patent: 3849136 (1974-11-01), Grebe
patent: 3943622 (1976-03-01), Kim et al.
patent: 3982943 (1976-09-01), Feng
Haddad et al., IBM Tech. Dis. Bull, vol. 2. No. 1, 6-1959, p. 9.

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