High temperature isostatic pressure bonding of hollow...

Receptacles – End wall structure – Joint or seam between sidewall and end wall

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C220S678000, C228S193000

Reexamination Certificate

active

09434507

ABSTRACT:
A bond joint and process of bonding metal parts to one another to form seamless, hollow metal articles, particularly made from beryllium. Tooling is assembled to the parts, prior to hot pressing, to cause pressure to be applied to flanges that extend peripherally from the parts. The parts, assembled together with the tooling, are then subjected to hot isostatic pressing of the flanges at a temperature of about 1700° F. to 1750° F., and at a pressure of about 2000 psi to 2500 psi, for around 3 hours. The tooling surrounding the metal parts functions to limit the amount of compression of the flanges. Articles formed by this process are particularly useful in space flight applications because they are formed of a homogeneous material. This means that the articles can operate under high pressure despite being subjected to temperature cycling. Strength of the bond joint is enhanced because no filler metal is used. The absence of a filler metal also eliminates any thermal stress problems as a result of differences in coefficients of thermal expansion.

REFERENCES:
patent: 2082985 (1937-07-01), Mitchell
patent: 2121590 (1938-06-01), Espe
patent: 2613015 (1952-10-01), Keating
patent: 2941064 (1960-06-01), Gieser, Jr. et al.
patent: 3082521 (1963-03-01), Cohen
patent: 3153492 (1964-10-01), Clair, Jr.
patent: 3739617 (1973-06-01), Stejskal
patent: 3872576 (1975-03-01), Mott
patent: 3940268 (1976-02-01), Catlin
patent: 3964667 (1976-06-01), Anderson
patent: 3980220 (1976-09-01), Wolfe et al.
patent: 4096615 (1978-06-01), Cross
patent: 4141484 (1979-02-01), Hamilton et al.
patent: 4152816 (1979-05-01), Ewing et al.
patent: 4155157 (1979-05-01), Gersbacher
patent: 4429824 (1984-02-01), Woodward
patent: 4492669 (1985-01-01), Gould
patent: 4575327 (1986-03-01), Borchert et al.
patent: 4581300 (1986-04-01), Hoppin, III et al.
patent: 4724975 (1988-02-01), Leventry
patent: 4988037 (1991-01-01), Cadwell
patent: 5002219 (1991-03-01), Cadwell
patent: 5386920 (1995-02-01), Romano et al.
patent: 5593085 (1997-01-01), Tohill et al.
patent: 5615826 (1997-04-01), Dixon et al.
patent: 601 773 (1994-06-01), None
patent: 654.214 (1951-06-01), None
patent: 56-049463 (1981-05-01), None
patent: 57-28689 (1982-02-01), None
patent: 62-34687 (1987-02-01), None
McGraw-Hill Dictionary of Scientific and Technical Terms 570, 2161 (Sybil P. packer ed., McGraw-Hill 1994).
HTTP://www.mkicorp.com/About%20Us/Diffusion.htm?Applications/Chemical/Nutsche.htm.
19 McGraw-Hill Encyclopedia of Science & Technology 436 (McGraw-Hill, 7thed. 1992).
Chemical Engineers' Handbook 23-38-39, 23-56 (Robert H. Peiry and Cecil H. Chilton eds., McGraw-Hill 5th1973).
16 Kirk-Othmer Encyclopedia of Chemical Technology 396 (John Wiley & Sons, 4thed. 1995).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High temperature isostatic pressure bonding of hollow... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High temperature isostatic pressure bonding of hollow..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High temperature isostatic pressure bonding of hollow... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3759805

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.