High temperature insulating structure

Details High temperature insulating structure High temperature insulating structure

1974-03-08

1976-11-09

Ansher, Harold

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

106 40R, 106 62, 252 62, 264 30, 264 43, 264 44, 428310, 428446, 428454, 428539, 428920, C04B 906, C04B 3510, C04B 3518

Patent

active

039912540

ABSTRACT:
A high temperature insulating structure adapted for use in a vibratile structure such as a manifold reactor or the like for automobiles, said structure consisting of two walls defining therebetween a space filled with heat insulating material, said material being formed by firing a slurry prepared by mixing a water solution of a phosphate compound and a heat resisting material consisting of 20 - 70 % by weight of silicon dioxide, 15 - 80 % by weight of aluminium oxide, and 0 - 30 % by weight of magnesium oxide.

REFERENCES:
patent: 2124865 (1938-07-01), Winkler et al.
patent: 2348395 (1944-05-01), Larson
patent: 2893888 (1959-07-01), Yarotsky
patent: 2949704 (1960-08-01), Jacobs
patent: 3048481 (1962-08-01), Eastman
patent: 3275721 (1966-09-01), Leroy et al.
patent: 3318723 (1967-05-01), Troell et al.
patent: 3357842 (1967-12-01), Bowman
patent: 3468750 (1969-09-01), Pfeifer et al.
patent: 3837630 (1974-09-01), Kohl et al.
patent: 3839517 (1974-10-01), Maine
patent: 3875271 (1975-04-01), Martin
patent: 3885977 (1975-05-01), Lachman et al.
patent: 3891734 (1975-06-01), Chauvin
patent: 3892580 (1975-07-01), Messing
patent: 3940276 (1976-02-01), Wilson

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