High temperature electronics assembly using lead-antimony-tin al

Details High temperature electronics assembly using lead-antimony-tin al High temperature electronics assembly using lead-antimony-tin al

1998-05-22

2000-05-23

Speer, Timothy

Stock material or miscellaneous articles

Composite

Of metal

428645, 428901, B32B 1504

Patent

active

060664029

ABSTRACT:
A system for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The solder uniquely provides a sufficiently low melting point to enable mass flow without destruction of plastic package parts, and a sufficiently high melting point to achieve 200 degrees C. operation. Good mechanical strength is achieved while providing sufficient creep to permit differential expansion between components and a printed wiring board. A heavy solder layer is coated on a printed wiring board and is oxidized to generate a thin solderable layer. Manufacture of the circuit board can be performed with conventional techniques such as wave soldering, hand soldering, solder printing, solder dispensing, and solder pre-forms.

REFERENCES:
patent: 1087561 (1914-02-01), Tebbetts, II

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