High temperature electromigration stress test system, test socke

Details High temperature electromigration stress test system, test socke High temperature electromigration stress test system, test socke

1996-09-19

1998-06-02

Karlsen, Ernest F.

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

324760, 324538, 219209, 438 14, G01R 3102

Patent

active

057605955

ABSTRACT:
A test socket is provided as part of a high temperature electromigration test system to allow the prediction of median time to failure to temperatures in excess of 450.degree. C. of VSLI interconnects.

REFERENCES:
patent: 4963517 (1990-10-01), Goto et al.
patent: 5030905 (1991-07-01), Figal
patent: 5266895 (1993-11-01), Yamashita
patent: 5434385 (1995-07-01), Biery et al.
patent: 5436567 (1995-07-01), Wexler et al.
patent: 5436569 (1995-07-01), Melgaard
patent: 5475317 (1995-12-01), Smith
patent: 5519193 (1996-05-01), Freiermuth
patent: 5646540 (1997-07-01), Stals

Affiliated with

Also associated with

Rating

High temperature electromigration stress test system, test socke does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High temperature electromigration stress test system, test socke, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High temperature electromigration stress test system, test socke will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1464479