High temperature electrical connection and method of producing s

Details High temperature electrical connection and method of producing s High temperature electrical connection and method of producing s

1981-08-31

1983-03-29

Tung, T.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

174 74R, 174 75R, 29592R, G01N 2746

Patent

active

043782795

ABSTRACT:
Improved lead attachment method accommodates a situation wherein electrical signal leads must be connected to portions of a circuit operating at high temperatures such as 900.degree. F. or more and terminate in equipment operating at or near ambient temperatures. For example, in solid electrolyte oxygen sensors incorporating a tubular ceramic member, a connection wire which is sufficiently thick to resist wire breakage during normal handling has been found to be too thick to bond to a connection pad on the ceramic without having the bond crack during thermal cycling. With improved method, a thin wire is attached to a thicker one in a region where flexing cannot occur. At least the larger wire is shrunk-fit into a hole formed in the ceramic before firing, and then the thinner wire is bonded to the pad with a conductive paste which must also be fired.

REFERENCES:
patent: 3616413 (1971-10-01), Reichner
patent: 3657094 (1972-04-01), Hans et al.
patent: 3719574 (1973-03-01), Richardson
patent: 3723279 (1973-03-01), Fruehan et al.
patent: 3758397 (1973-09-01), Rittiger et al.
patent: 3784459 (1974-01-01), Jackson
patent: 4229275 (1980-10-01), Habdas et al.
patent: 4251342 (1981-02-01), Habdas et al.

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