High temperature disengaging fluid coupling

Details High temperature disengaging fluid coupling High temperature disengaging fluid coupling

1992-10-22

1993-09-28

Lorence, Richard M.

192 clutches and power-stop control

Clutches

Fluent material

192 82T, F16D 3502, F16D 4325

Patent

active

052480186

ABSTRACT:
A fluid coupling device is described of the type defining a fluid chamber divided by a valve plate (29) into a fluid operating chamber (31) and a fluid reservoir chamber (33). The valve plate defines a fluid inlet (55) and a discharge opening (51). Flow of fluid between the chambers (31) and (33) is controlled by a valve member (41) including first (57) and second (59) inlet covering portions, and a discharge covering portion (61). The valve member is controlled normally in response to external ambient air temperature, by means of a bimetal coil (43). When input speed to the coupling device becomes extremely high, slip speed increases, thus increasing the fluid temperature within the coupling. This additional heat causes the bimetal coil (43) to move the valve arm to a disengaged position (FIG. 4) in which the fluid inlet (55) is once again covered, and the discharge opening (51) is again uncovered, permitting the coupling device to operate in a disengaged mode.

REFERENCES:
patent: 3363734 (1968-11-01), Sabat
patent: 3587801 (1971-06-01), Riner
patent: 4051936 (1977-10-01), Crisenbery et al.
patent: 4469209 (1984-09-01), Hayashi et al.
patent: 4502580 (1985-03-01), Clancey
patent: 4606445 (1986-08-01), Rockey
patent: 4662495 (1987-05-01), Brunken
patent: 4974712 (1990-12-01), Brown

Affiliated with

Also associated with

Rating

High temperature disengaging fluid coupling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High temperature disengaging fluid coupling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High temperature disengaging fluid coupling will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2186228