High temperature co-fired ceramic integrated phased array packag

Communications: radio wave antennas – Antennas – Microstrip

Patent

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Details

257700, 257728, H01Q 2300

Patent

active

051988240

ABSTRACT:
A phased array package using a cofired ceramic material system to integrate antenna elements and an hermetic multi-chip MMIC cavity into a single module to provide incorporation of microwave circuit geometries into a system which has been used in the prior art only for low frequency applications. The integration provides a package very similar to a conventional integrated circuit package with substantial cost reductions over the complicated microwave assemblies of the present art.

REFERENCES:
patent: 4771294 (1988-09-01), Wasilovsky
patent: 4899118 (1990-02-01), Pounski, Sr.

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