High temperature co-fired ceramic integrated phased array packag

Details High temperature co-fired ceramic integrated phased array packag High temperature co-fired ceramic integrated phased array packag

1992-01-17

1993-03-30

Hille, Rolf

Communications: radio wave antennas

Antennas

Microstrip

257700, 257728, H01Q 2300

Patent

active

051988240

ABSTRACT:
A phased array package using a cofired ceramic material system to integrate antenna elements and an hermetic multi-chip MMIC cavity into a single module to provide incorporation of microwave circuit geometries into a system which has been used in the prior art only for low frequency applications. The integration provides a package very similar to a conventional integrated circuit package with substantial cost reductions over the complicated microwave assemblies of the present art.

REFERENCES:
patent: 4771294 (1988-09-01), Wasilovsky
patent: 4899118 (1990-02-01), Pounski, Sr.

Affiliated with

Also associated with

Rating

High temperature co-fired ceramic integrated phased array packag does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High temperature co-fired ceramic integrated phased array packag, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High temperature co-fired ceramic integrated phased array packag will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1284269