High temperature co-fired ceramic integrated phased array packag

Details High temperature co-fired ceramic integrated phased array packag High temperature co-fired ceramic integrated phased array packag

1992-08-10

1993-06-15

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29840, 333247, H05K 336

Patent

active

052193772

ABSTRACT:
A phased array package using a cofired ceramic material system to integrate antenna elements and an hermetic multi-chip MMIC cavity into a single module to provide incorporation of microwave circuit geometries into a system which has been used in the prior art only for low frequency applications. The integration provides a package very similar to a conventional integrated circuit package with substantial cost reductions over the complicated microwave assemblies of the present art.

REFERENCES:
patent: 4771294 (1988-09-01), Wasilousky
patent: 4899118 (1990-02-01), Polinski, Sr.

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