High temperature circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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Details

174110N, 174117PC, 427423, H05K 109, H05K 314

Patent

active

044244088

ABSTRACT:
A high temperature circuit board made by flame spraying a high temperature resistant metal film, such as aluminum, zinc or silver solder braze alloy, onto a high temperature resistant insulative substrate in which in one embodiment a reverse circuit image resist is layed on the board surface and the metal is flame sprayed onto the board surface and the reverse image resist screen is then removed leaving the circuit without etching. In the other embodiment aluminum is flame sprayed onto the substrate and then a silver solder braze alloy or copper or nickel is flame sprayed onto the aluminum film, and then resist and etching stops are applied to remove unwanted metal to the substrate and the resist is stripped providing the high temperature printed circuit board.

REFERENCES:
patent: 2861911 (1958-11-01), Martin
patent: 2876530 (1959-03-01), Howatt
patent: 3023390 (1962-02-01), Moratis
patent: 3666617 (1972-05-01), Marciniak
patent: 3680209 (1972-08-01), Hacke
patent: 3781596 (1973-12-01), Galli
patent: 3811934 (1974-05-01), Glaser
patent: 3891901 (1975-06-01), Booe
Multi-Layer P-C Boards are Both Rigid and Flexible in all the Right Places, Electronics, Feb. 16, 1970, p. 116-121.
Du Pont Kapton Polyamide Film, Bull. H-1a.

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