High temperature ceramic socket configured to test packaged...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C439S070000

Reexamination Certificate

active

07602201

ABSTRACT:
A test socket assembly is for use in testing integrated circuits. A single piece socket is formed substantially of an insulating material and having a plurality of holes formed therein configured to receive a plurality of electrically conductive springs. Each hole of the single piece socket has therein a separate one of the electrically conductive springs. A test socket includes a plurality of pins configured to receive leads of an integrated circuit, the pins of the test socket extending into the plurality of holes of the single piece socket with each pin engaging a spring, wherein the single piece socket is positioned on a circuit board with the plurality of holes being in alignment with electrical contacts on the circuit board such that the plurality of springs are electrically interconnecting the contacts and the plurality of pins. The single -piece socket is comprised substantially of a high-temperature insulating material, such as ceramic.

REFERENCES:
patent: 4326765 (1982-04-01), Brancaleone
patent: 5038467 (1991-08-01), Murphy
patent: 5199889 (1993-04-01), McDevitt, Jr.
patent: 5399108 (1995-03-01), Lu et al.
patent: 5479105 (1995-12-01), Kim et al.
patent: 5519331 (1996-05-01), Cowart et al.
patent: 5523586 (1996-06-01), Sakurai
patent: 5534787 (1996-07-01), Levy
patent: 5568057 (1996-10-01), Kim et al.
patent: 6208155 (2001-03-01), Barabi et al.
patent: 6278283 (2001-08-01), Tsugai
patent: 6667628 (2003-12-01), Ahrikencheikh et al.
patent: 6798228 (2004-09-01), Cuevas
patent: 6821131 (2004-11-01), Suzuki et al.
patent: 6958616 (2005-10-01), Mahoney et al.
patent: 7172450 (2007-02-01), Sylvia et al.
patent: 2004/0140821 (2004-07-01), Lee
patent: 2005/0280428 (2005-12-01), Ishikawa et al.
International Search Report from Corresponding PCT Application No. PCT/US08/63902 dated Aug. 19, 2008.
Written Opinion from Corresponding PCT Application No. PCT/US08/63902 dated Aug. 19, 2008.

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