High temperature ceramic die package and DUT board socket

Details High temperature ceramic die package and DUT board socket High temperature ceramic die package and DUT board socket

2008-05-21

2009-10-06

Tang, Minh N (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C361S802000

Reexamination Certificate

active

07598760

ABSTRACT:
A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one “well” location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).

REFERENCES:
patent: 6049975 (2000-04-01), Clayton
patent: 6191474 (2001-02-01), Kinsman et al.
International Search Report in corresponding PCT application No. PCT/US09/44676, mailed Jul. 6, 2009.
Written Opinion in corresponding PCT application No. PCT/US09/44676, mailed Jul. 6, 2009.

Affiliated with

Also associated with

Rating

High temperature ceramic die package and DUT board socket does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High temperature ceramic die package and DUT board socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High temperature ceramic die package and DUT board socket will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4099545