High temperature attachment of organic molecules to substrates

Details High temperature attachment of organic molecules to substrates High temperature attachment of organic molecules to substrates

2007-05-29

2007-05-29

Smith, Bradley K (Department: 2891)

Semiconductor device manufacturing: process

Having organic semiconductive component

C257SE27117

Reexamination Certificate

active

10742596

ABSTRACT:
This invention provides a new procedure for attaching molecules to semiconductor surfaces, in particular silicon. The molecules, which include, but are not limited to porphyrins and ferrocenes, have been previously shown to be attractive candidates for molecular-based information storage. The new attachment procedure is simple, can be completed in short times, requires minimal amounts of material, is compatible with diverse molecular functional groups, and in some instances affords unprecedented attachment motifs. These features greatly enhance the integration of the molecular materials into the processing steps that are needed to create hybrid molecular/semiconductor information storage devices.

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