High temperature annealing to improve SIMOX characteristics

Coating processes – Coating by vapor – gas – or smoke – Base includes an inorganic compound containing silicon or...

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4272553, 4273722, 4273741, 427402, 427225, 427233, 427238, 427243, C23C 1624, C23C 1640

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048246980

ABSTRACT:
The present invention provides a method of treating a SIMOX wafer so that oxygen precipitates and heavy metal, carbon, and other contaminants are substantially reduced. The method includes forming a protective layer on the SIMOX surface, heating the wafer and protective layer so that the precipitates and contaminants disolve and diffuse into the protective layer, and slowly cooling the wafer to permit continued diffusion during cooling.

REFERENCES:
patent: 4386968 (1983-07-01), Hinkel et al.
patent: 4631804 (1986-12-01), Roy
M. J. Kim et al., "Surface Restoration of Oxygen-Implanted Silicon," Journal of Applied Physics, 54(4), Apr. 1983, pp. 1991-1999.

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