High temperature amorphous semiconductor member and method of ma

Compositions – Radioactive compositions – Nuclear reactor fuel

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357 4, 357 61, 357 63, 252 635, H01L 4500

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041774744

ABSTRACT:
An amorphous semiconductor member which is capable of withstanding high temperatures and of having good toughness characteristics comprises an amorphous semiconductor material including a composition of a plurality elements, at least one of which is a low atomic weight element comprising boron, carbon, nitrogen or oxygen, formed in a solid amorphous host matrix having structural configuration which have local rather than long range order and electronic configurations providing an energy gap and an electrical activation energy. It also includes a modifier material added to the amorphous host matrix, such as a transition metal or rare earth element, having orbitals which interact with the amorphous host matrix and form electronic states in the energy gap which modify substantially the electronic configurations of the amorphous host matrix at room temperature and above. The amorphous semiconductor member may also comprise an amorphous host matrix formed from boron, carbon, silicon or germanium having a modifier material of boron or carbon added thereto. The forming of the amorphous host matrix and the adding of the modifier material is preferably done by cosputtering or the like.

REFERENCES:
patent: 3688160 (1972-08-01), Nagasawa
patent: 3716844 (1973-02-01), Brodsky
patent: 3864717 (1975-02-01), Merrin
patent: 3983542 (1976-09-01), Ovishinsky
Shimakawa, Japan J. Appl. Phys., 10 (1971), pp. 1116-1117.
Petersen, et al., IEEE Transactions on Electron Devices, vol. ED-23, No. 4, Apr. 1973, pp. 471-477.
Spear, Proceed. 5th Int. Conf. on Amorphous Semiconductors, Partenkirche, Fed. Rep. Germany, Sep. 3-8, 1973.

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