High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)

Details High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy) High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)

1987-02-06

1989-01-10

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

4284735, 528125, 528128, 528186, 528187, 528188, 528228, 528353, C08G 7310

Patent

active

047974664

ABSTRACT:
This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application.
The polyimide has recurring units of the formula ##STR1## (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).
The polyimide can be prepared by reacting 2,6-bis(3-aminophenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid.
Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'-benzophenonetetracarboxylic dianhydride.

REFERENCES:
patent: 3716549 (1973-02-01), Darsow et al.
patent: 4111906 (1978-09-01), Jones et al.
patent: 4203922 (1980-05-01), Jones et al.
patent: 4535101 (1985-08-01), Lee et al.

Affiliated with

Also associated with

Rating

High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy) does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy), we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy) will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2108344