High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phen

Details High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phen High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phen

1987-02-25

1989-01-03

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

528125, 528128, 528183, 528187, C08G 7310

Patent

active

047957980

ABSTRACT:
This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) ##STR1## (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).
The polyimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3',4,4'- biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3'4,4'-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.

REFERENCES:
patent: 3716549 (1973-02-01), Darsow et al.
patent: 4111906 (1978-09-01), Jones et al.
patent: 4203922 (1980-05-01), Jones et al.
patent: 4535101 (1985-08-01), Lee et al.

Affiliated with

Also associated with

Rating

High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phen does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phen, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phen will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2169026