Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Noninterengaged fiber-containing paper-free web or sheet...
Patent
1987-07-09
1989-08-22
Lesmes, George F.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Noninterengaged fiber-containing paper-free web or sheet...
428458, 4284735, 1563073, 1563077, 156311, 1563309, B32B 2700, B32B 2706
Patent
active
048595306
ABSTRACT:
Thermoplastic polyimides of benzophenone tetracarboxylic acid or an ester or anhydride thereof and a 2,2-bis[4-(amino-phenoxy)phenyl]hexafluoropropane are excellent adhesives for bonding polyimide films to various substrates including polyimide film, metals, etc. The film and substrate need not be abraded before application of the polyamic acid resin or polyimide precursor from which the polyimide is formed on curing. The bond is tenacious. Even after heating to 800.degree. F. the bond was stronger than two different polyimide films. Interposing between the polyimide film and the substrate a strip or patch of a prepreg made from polyimide precursor solutions composed of monomers, solvent and polyamide acid, and applying heat to cure the resin in situ while keeping the components in intimate contact by application of slight pressure is a preferred way of applying and utilizing the adhesives. Such prepregs are also useful for bonding metal to metal or to various other substrates.
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Adhesives Age, Jan. 1979, pp. 35-39.
R. T. Alvarez "600.degree. F. Thermoplastic Polyimide Adhesive", a paper presented at the 29th National SAMPE Symposium, Apr. 3-5, 1987.
Lambert Jules A.
Roark David N.
Ethyl Corporation
Harbin A.
Lesmes George F.
Sieberth John F.
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