High surface area nitride, carbide and boride electrodes and met

Details High surface area nitride, carbide and boride electrodes and met High surface area nitride, carbide and boride electrodes and met

1994-12-12

1997-10-21

Picard, Leo P.

Electricity: electrical systems and devices

Electrolytic systems or devices

Solid electrolytic capacitor

427530, 427528, 361532, H01G 904

Patent

active

056802927

ABSTRACT:
High surface area electrodes for use in electrical and electrochemical energy storage and conversion devices comprise conductive transition metal nitrides, carbides, borides or combinations thereof where the metal is molybdenum or tungsten. Disclosed is a method of manufacturing such electrodes by forming or depositing a layer of metal oxide, then exposing the metal oxide layer at elevated temperature to a source of nitrogen, carbon or boron in a chemically reducing environment to form the desired metal nitride, carbide or boride film. Also disclosed is an ultracapacitor comprised of the new high surface area electrodes having a specific capacitance of 100 mF/cm.sup.2 and an energy density of 100 mJ/cm.sup.3 with improved conductivity and chemical stability when compared to currently available electrodes.

REFERENCES:
patent: 4271041 (1981-06-01), Boudart
patent: 4327400 (1982-04-01), Muranaka
patent: 4515763 (1985-05-01), Boudart
patent: 4851206 (1989-07-01), Boudart
patent: 5062025 (1991-10-01), Verhoeven
patent: 5079674 (1992-01-01), Malaspina
patent: 5185679 (1993-02-01), Maniar

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