High surface area electrode structures for electrochemical proce

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204284, 204290F, C25B 1104

Patent

active

052943194

ABSTRACT:
A porous, high surface area electrode comprising a fine fibrous conductive substrate having a density less than about 50% and a specific surface area to volume ratio of greater than about 30 cm.sup.2 /cm.sup.3. The individual fibers of the substrate have a length to diameter aspect ratio greater than 1000:1. An electrocatalyst covers at least a portion of the substrate. A current distributor is electrically connected to the coated substrate. The method of fabricating the electrode includes fabricating a fine fibrous conductive substrate, preparing the surface of the substrate for receiving an electrocatalyst covering thereon, preparing the electrocatalyst for application to the substrate and applying the electrocatalyst to the substrate. Optionally, the electrode may be further treated to promote adhesion of the electrocatalyst to the substrate.

REFERENCES:
patent: 2163793 (1939-06-01), Logan
patent: 2717237 (1955-09-01), Rampel
patent: 3486928 (1969-12-01), Rhoda et al.
patent: 3674675 (1972-07-01), Leaman
patent: 3698939 (1972-10-01), Leaman
patent: 4456510 (1984-06-01), Murakami et al.
patent: 4542008 (1985-09-01), Capuano et al.
patent: 4683039 (1987-07-01), Twardowski et al.
patent: 4737257 (1988-04-01), Boulton
patent: 4806215 (1989-02-01), Twardowski
patent: 4853096 (1989-08-01), Lipsztajn et al.
patent: 4902535 (1990-02-01), Garg et al.
patent: 5041196 (1991-08-01), Cawlfield et al.
patent: 5084149 (1992-01-01), Kaczur et al.
"Chlorine Dioxide Chemistry and Environmental Impact of Oxychlorine Compounds" published 1979 by Ann Arbor Science Publishers, Inc. at pp. 111-144.
"Modern Electroplating" sponsored by The Electrochemical Society, Inc. (1974) Chapter 13, at pp. 342-357.
"Deposition of Platinum by Chemical Reduction of Aqueous Solutions" by F. H. Leaman. appearing in Connector Products Division, AMP, Inc. Harrisburg, Pa. May 1972, at pp. 440-444.
"Barrel Plating by Means of Electroless Palladium" by R. N. Rhoda, appearing in Journal of the Electrochemical Society, (Jul. 1961) 108, at pp. 707-708.
"Immersion Plating of the Platinum Group Metals" by R. W. Johnson, appearing in Journal of the Electrochemical Society, 108, No. 7. (Jul. 1961) 632-635.
Chemical Abstracts, vol. 103, No. 12, "Formation of Platinum or Platinum Alloy Electrodes on Ion-Exchanging Membranes". Sep. 23, 1985.
Chemical Abstracts, vol. 108, No. 26, "Platinum Film Electrodes (I) Platinum Film on Titanium or Titanium Dioxide-Covered Titanium" Jun. 27, 1988.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High surface area electrode structures for electrochemical proce does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High surface area electrode structures for electrochemical proce, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High surface area electrode structures for electrochemical proce will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1533795

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.