High surface area alumina and other aluminum products method of

Details High surface area alumina and other aluminum products method of High surface area alumina and other aluminum products method of

1998-04-03

2000-05-16

Dunn, Tom

Chemistry of inorganic compounds

Oxygen or compound thereof

Metal containing

423628, 423630, 502414, 502415, 502439, 502506, C01F 702, B01J 2000, B01J 2104

Patent

active

060633581

ABSTRACT:
A process for producing alumina and other aluminia products where the formation of a Schiff base imine by reaction of a orgaonaluminum amide or imide oligomer with a carbonyl compound is promoted by the Lewis acid character of the oligomer. The water byproduct of the Schiff base serves as an in situ reagent for subsequent hydrolysis and sol-gel condensation of the aluminum species with concomitant production of alkane. The imine then is washed from the alumina with a suitable solvent. Any of a number of primary amines and aldehydes or ketones may be reagents. Calcining of the sol-gels yields high surface area alumina as characterized by scanning electron microscopy, and gas physisorption measurements. Microporous and/or mesoporous alumina is obtained depending on synthesis conditions. Alumina microspheres are obtained under certain conditions.

REFERENCES:
patent: 3950478 (1976-04-01), Kenworthy et al.
patent: 4508841 (1985-04-01), Onuma et al.
patent: 5412128 (1995-05-01), Imuta et al.
patent: 5420089 (1995-05-01), Tomotsu et al.
patent: 5457173 (1995-10-01), Jensen
patent: 5561093 (1996-10-01), Fujita et al.

Affiliated with

Also associated with

Rating

High surface area alumina and other aluminum products method of does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High surface area alumina and other aluminum products method of , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High surface area alumina and other aluminum products method of will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-256175