High-strength solder joint

Details High-strength solder joint High-strength solder joint

2005-07-19

2005-07-19

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S618000, C257S779000, C257S781000

Reexamination Certificate

active

06919137

ABSTRACT:
A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a layer sturcture of nickel layer/intermetallic compound layer/solder layer is formed. The intermetallic compound layer is composed mainly of tin (Sn) and copper (Cu), and further including nickel (Ni). The intermetallic compound layer has cauliflower-shaped surfaces formed in a solder-layer's side thereof.

REFERENCES:
patent: 4871108 (1989-10-01), Boecker et al.
patent: 5199487 (1993-04-01), DiFrancesco et al.
patent: 5260234 (1993-11-01), Long
patent: 5492863 (1996-02-01), Higgins
patent: 6137690 (2000-10-01), Carson et al.
patent: 6175152 (2001-01-01), Toyoda
patent: 6184061 (2001-02-01), Wu et al.
patent: 6224690 (2001-05-01), Andricacos et al.
patent: 6358630 (2002-03-01), Tsukada et al.
patent: 6486411 (2002-11-01), Miura et al.
patent: 6548898 (2003-04-01), Matsuki et al.
patent: 03 291991 (1991-12-01), None
patent: 07 007243 (1995-01-01), None
patent: 9-326554 (1997-12-01), None
patent: 11-077371 (1999-03-01), None
patent: WO 98 36626 (1998-08-01), None
patent: WO 98 56217 (1998-12-01), None

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