High strength silver palladium alloy

Details High strength silver palladium alloy High strength silver palladium alloy

1997-04-10

1998-11-10

Phipps, Margery

Metal treatment

Stock

Containing over 50 per cent metal, but no base metal

148430, 420503, 420587, C22C 3000, C22C 506, C22C 508

Patent

active

058337741

ABSTRACT:
A silver/palladium alloy for electrical contact applications comprises, on a weight percent basis, 20-50 silver, 20-50 palladium, 20-40 copper, less than 1.0 nickel, 0.1-5 zinc, 0.01-0.3 boron, and up to 1 percent by weight of modifying elements selected from the group consisting of rhenium, ruthenium, gold, and platinum. The combination of zinc and boron provides an alloy of high strength and hardness and permits the use of lower amounts of both copper and palladium.

REFERENCES:
patent: 1935897 (1933-11-01), Wise
patent: 2138599 (1938-11-01), Gwyn, Jr.
patent: 2222544 (1940-12-01), Spanner et al.
patent: 4980245 (1990-12-01), Marino
patent: 5000779 (1991-03-01), German et al.
patent: 5484569 (1996-01-01), Klein et al.

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