High strength paperboard panel

Details High strength paperboard panel High strength paperboard panel

1986-10-27

1988-03-29

Bueker, Richard R.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including grain, strips, or filamentary elements in...

428138, 428182, 428186, 428212, B32B 312

Patent

active

047343087

ABSTRACT:
A method of producing paperboard and a paperboard structure wherein the grain lines of upper and lower chipboard panels are aligned at right angles in relation to the undulations formed in a midstratum layer to yield an overall panel assembly having a high degree of bending resistance.
The invention also relates generally to a panel assembly having a particular novel layered construction. In place of a conventional solid chipboard laminated construction, an undulated midstratum layer is utilized in such manner that air cells or pockets are formed within the structure. An overlayer and an underlayer are adhesively applied to the undulated midstratum layer. The invention results in a panel assembly which may be much more economically manufactured while yielding superior end product strength and durability. The invention has widespread utility as a superior substitute for the currently used solid laminated chipboard design.

REFERENCES:
patent: 1605953 (1926-11-01), Howard
patent: 3115431 (1963-12-01), Stokes et al.
patent: 4262050 (1981-04-01), Jenkins
patent: 4673608 (1987-06-01), Cline

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