High strength lead-free solder materials

Details High strength lead-free solder materials High strength lead-free solder materials

1996-12-12

1999-11-16

Ip, Sikyin

Alloys or metallic compositions

Tin base

Copper containing

148400, C22C 1300

Patent

active

059852127

ABSTRACT:
Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.01 and 9.5 weight percent Cu, between about 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.5 and 6.5 weight percent Ag, between 0.5 and 8.0 weight percent Bi, and optionally including one or more of the following elements: between 0.1 and 10.0 weight percent In, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.1 and 0.8 weight percent Ag, between 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 1.0 weight percent, Ga in an amount of not greater than 1.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent.

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