High strength L1 2 aluminum alloys

Metal treatment – Stock – Aluminum base

Reexamination Certificate

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C148S690000, C148S693000, C420S542000, C420S543000

Reexamination Certificate

active

07871477

ABSTRACT:
High temperature heat treatable aluminum alloys that can be used at temperatures from about −420° F. (−251° C.) up to about 650° F. (343° C.) are described. The alloys are strengthened by dispersion of particles based on the L12intermetallic compound Al3X. These alloys comprise aluminum, magnesium, lithium, at least one of scandium, erbium, thulium, ytterbium, and lutetium, and at least one of gadolinium, yttrium, zirconium, titanium, hafnium, and niobium.

REFERENCES:
patent: 3619181 (1971-11-01), Willey et al.
patent: 3816080 (1974-06-01), Bomford et al.
patent: 4041123 (1977-08-01), Lange et al.
patent: 4259112 (1981-03-01), Dolowy, Jr. et al.
patent: 4463058 (1984-07-01), Hood et al.
patent: 4469537 (1984-09-01), Ashton et al.
patent: 4499048 (1985-02-01), Hanejko
patent: 4597792 (1986-07-01), Webster
patent: 4626294 (1986-12-01), Sanders, Jr.
patent: 4647321 (1987-03-01), Adam
patent: 4661172 (1987-04-01), Skinner et al.
patent: 4667497 (1987-05-01), Oslin et al.
patent: 4689090 (1987-08-01), Sawtell et al.
patent: 4710246 (1987-12-01), Le Caer et al.
patent: 4713216 (1987-12-01), Higashi et al.
patent: 4755221 (1988-07-01), Paliwal et al.
patent: 4853178 (1989-08-01), Oslin
patent: 4865806 (1989-09-01), Skibo et al.
patent: 4874440 (1989-10-01), Sawtell et al.
patent: 4915605 (1990-04-01), Chan et al.
patent: 4927470 (1990-05-01), Cho
patent: 4933140 (1990-06-01), Oslin
patent: 4946517 (1990-08-01), Cho
patent: 4964927 (1990-10-01), Shiflet et al.
patent: 4974510 (1990-12-01), Fischer et al.
patent: 4988464 (1991-01-01), Riley
patent: 5032352 (1991-07-01), Meeks et al.
patent: 5053084 (1991-10-01), Masumoto et al.
patent: 5055257 (1991-10-01), Chakrabarti et al.
patent: 5059390 (1991-10-01), Burleigh et al.
patent: 5066342 (1991-11-01), Rioja et al.
patent: 5076340 (1991-12-01), Bruski et al.
patent: 5076865 (1991-12-01), Hashimoto et al.
patent: 5130209 (1992-07-01), Das et al.
patent: 5133931 (1992-07-01), Cho
patent: 5198045 (1993-03-01), Cho et al.
patent: 5211910 (1993-05-01), Pickens et al.
patent: 5226983 (1993-07-01), Skinner et al.
patent: 5256125 (1993-10-01), Jones
patent: 5308410 (1994-05-01), Horimura et al.
patent: 5312494 (1994-05-01), Horimura et al.
patent: 5318641 (1994-06-01), Masumoto et al.
patent: 5397403 (1995-03-01), Horimura et al.
patent: 5458700 (1995-10-01), Masumoto et al.
patent: 5462712 (1995-10-01), Langan et al.
patent: 5480470 (1996-01-01), Miller et al.
patent: 5597529 (1997-01-01), Tack
patent: 5620652 (1997-04-01), Tack et al.
patent: 5624632 (1997-04-01), Baumann et al.
patent: 5882449 (1999-03-01), Waldron et al.
patent: 6139653 (2000-10-01), Fernandes et al.
patent: 6149737 (2000-11-01), Hattori et al.
patent: 6248453 (2001-06-01), Watson
patent: 6254704 (2001-07-01), Laul et al.
patent: 6258318 (2001-07-01), Lenczowski et al.
patent: 6309594 (2001-10-01), Meeks, III et al.
patent: 6312643 (2001-11-01), Upadhya et al.
patent: 6315948 (2001-11-01), Lenczowski et al.
patent: 6331218 (2001-12-01), Inoue et al.
patent: 6355209 (2002-03-01), Dilmore et al.
patent: 6368427 (2002-04-01), Sigworth
patent: 6506503 (2003-01-01), Mergen et al.
patent: 6517954 (2003-02-01), Mergen et al.
patent: 6524410 (2003-02-01), Kramer et al.
patent: 6531004 (2003-03-01), Lenczowski et al.
patent: 6562154 (2003-05-01), Rioja et al.
patent: 6630008 (2003-10-01), Meeks, III et al.
patent: 6702982 (2004-03-01), Chin et al.
patent: 6902699 (2005-06-01), Fritzemeier et al.
patent: 6918970 (2005-07-01), Lee et al.
patent: 7048815 (2006-05-01), Senkov et al.
patent: 7097807 (2006-08-01), Meeks, III et al.
patent: 7241328 (2007-07-01), Keener
patent: 7344675 (2008-03-01), Van Daam et al.
patent: 2001/0054247 (2001-12-01), Stall et al.
patent: 2003/0192627 (2003-10-01), Lee et al.
patent: 2004/0046402 (2004-03-01), Winardi
patent: 2004/0055671 (2004-03-01), Olson et al.
patent: 2004/0089382 (2004-05-01), Senkov et al.
patent: 2004/0170522 (2004-09-01), Watson
patent: 2004/0191111 (2004-09-01), Nie et al.
patent: 2005/0147520 (2005-07-01), Canzona
patent: 2006/0011272 (2006-01-01), Lin et al.
patent: 2006/0093512 (2006-05-01), Pandey
patent: 2006/0172073 (2006-08-01), Groza et al.
patent: 2006/0269437 (2006-11-01), Pandey
patent: 2007/0048167 (2007-03-01), Yano
patent: 2007/0062669 (2007-03-01), Song et al.
patent: 2008/0066833 (2008-03-01), Lin et al.
patent: 1436870 (2003-08-01), None
patent: 101205578 (2008-06-01), None
patent: 0 208 631 (1986-06-01), None
patent: 0 584 596 (1994-03-01), None
patent: 1 111 079 (2001-06-01), None
patent: 1 249 303 (2002-10-01), None
patent: 1 170 394 (2004-04-01), None
patent: 1 439 239 (2004-07-01), None
patent: 1 471 157 (2004-10-01), None
patent: 1 728 881 (2006-06-01), None
patent: 1 111 078 (2006-09-01), None
patent: 1 788 102 (2007-05-01), None
patent: 2 656 629 (1990-12-01), None
patent: 2843754 (2004-02-01), None
patent: 04218638 (1992-08-01), None
patent: 9104940 (1997-04-01), None
patent: 9279284 (1997-10-01), None
patent: 11156584 (1999-06-01), None
patent: 2000119786 (2000-04-01), None
patent: 2001038442 (2001-02-01), None
patent: 2007188878 (2007-07-01), None
patent: 2001144 (1993-10-01), None
patent: 2001145 (1993-10-01), None
patent: 90 02620 (1990-03-01), None
patent: 91 10755 (1991-07-01), None
patent: 91 11540 (1991-08-01), None
patent: 95/32074 (1995-11-01), None
patent: 96/10099 (1996-04-01), None
patent: WO 96/10099 (1996-04-01), None
patent: 9833947 (1998-08-01), None
patent: 00/37696 (2000-06-01), None
patent: 02 29139 (2002-04-01), None
patent: 03 052154 (2003-06-01), None
patent: 03085145 (2003-10-01), None
patent: 03085146 (2003-10-01), None
patent: 03 104505 (2003-12-01), None
patent: 2004 005562 (2004-01-01), None
patent: 2004046402 (2004-06-01), None
patent: 2005045080 (2005-05-01), None
patent: 2005047554 (2005-05-01), None
European Search Report and Written Opinion—EP 09 25 1014—Dated Jun. 30, 2009—8 Pages.
Cook, R., et al. “Aluminum and Aluminum Alloy Powders for P/M Applications.” The Aluminum Powder Company Limited, Ceracon Inc.
“Aluminum and Aluminum Alloys.” ASM Specialty Handbook. 1993. ASM International. p. 559.
ASM Handbook, vol. 7 ASM International, Materials Park, OH (1993) p. 396.
Gangopadhyay, A.K., et al. “Effect of rare-earth atomic radius on the devitrification of AI88RE8Ni4 amorphous alloys.” Philosophical Magazine A, 2000, vol. 80, No. 5, pp. 1193-1206.
Riddle, Y.W., et al. “Improving Recrystallization Resistance in WRought Aluminum Alloys with Scandium Addition.” Lightweight Alloys for Aerospace Applications VI (pp. 26-39), 2001 TMS Annual Meeting, New Orleans, Louisiana, Feb. 11-15, 2001.
Baikowski Malakoff Inc. “The many uses of High Purity Alumina.” Technical Specs. http://www.baikowskimalakoff.com/ pdf/Rc-Ls.pdf (2005).
Lotsko, D.V., et al. “Effect of small additions of transition metals on the structure of Al-Zn-Mg-Zr-Sc alloys.” New Level of Properties. Advances in Insect Physiology. Academic Press, vol. 2, Nov. 4, 2002. pp. 535-536.
Neikov, O.D., et al. “Properties of rapidly solidified powder aluminum alloys for elevated temperatures produced by water atomization.” Advances in Powder Metallurgy & Particulate Materials. 2002. pp. 7-14-7-27.
Harada, Y. et al. “Microstructure of AI3Sc with ternary transition-metal additions.” Materials Science and Engineering A329-331 (2002) 686-695.
Unal, A. et al. “Gas Atomization” from the section “Production of Aluminum and Aluminum-Alloy Powder” ASM Handbook, vol. 7. 2002.
Riddle, Y.W., et al. “A Study of Coarsening, Recrystallization, and Morphology of Microstructure in Al-Sc-(Zr)-(Mg) Alloys.” Metallurgical and Materials Transactions A. vol. 35A, Jan. 2004. pp. 341-350.
Mil'Man, Y.V. et al. “Effect of Additional Alloying with Transition Metals on the STructure of an Al-7.1 Zn-1.3 Mg-0.12 Zr Alloy.” Metallofizika I Noveishie Teknohologii, 26 (10), 1363-1378, 2004.
Tian, N. et al. “Heating rate dependence of

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