High strength high conductivity Cu-alloy of precipitate growth s

Details High strength high conductivity Cu-alloy of precipitate growth s High strength high conductivity Cu-alloy of precipitate growth s

1996-11-26

1998-12-08

Ip, Sikyin

Metal treatment

Stock

Copper base

148554, 148685, C22C 902

Patent

active

058463461

ABSTRACT:
This invention relates to a high strength, high electrical conductivity copper alloy having excellent mechanical and physical properties, including thermal softening resistance, in which precipitate particles are finely dispersed (growth of the precipitate is suppressed), and the production process. The alloy is the precipitation suppressed copper alloy consisted of 0.5.about.4.0 wt % nickel, 0.1.about.1.0 wt % silicon, 0.05.about.0.8 wt % tin (Sn) and balance copper and inevitable impurities, wherein sizes of precipitate particles are below 0.5 .mu.m. The production process includes the steps of melting and casting raw materials, surface machining and cold rolling of the ingot, subjecting the cold rolled ingot to a precipitation process at a temperature ranging 450.about.520 deg. C. for 5.about.12 hours, cold rolling the precipitation processed material, and subjecting the cold rolled material to a tension annealing process at a temperature ranging 350.about.550 deg. C. for below 90 seconds.

Affiliated with

Also associated with

Rating

High strength high conductivity Cu-alloy of precipitate growth s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High strength high conductivity Cu-alloy of precipitate growth s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High strength high conductivity Cu-alloy of precipitate growth s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-173126